Welcome to XP Mold, a trustworthy plastic IC packaging mold or semiconductor lead frame mold manufacturer and supplier in China. We provide one step service from mold design,mold making and injection molding. Our molds mainly refer to multi cavities mold (we could up to 6000cavities for some molds ) and insert molding.
IC packaging Lead Frame Mold are molds or models used for manufacturing IC packaging substrates. These molds are precisely processed and manufactured according to specific design requirements, ensuring that the produced IC packaging substrates have high precision, high density, miniaturization, and thinness. These characteristics are essential to meet the demands of integrated circuit packaging.
Multi-cavity mold has multiple cavities within the mold. These cavities allow for the simultaneous production of multiple identical or different plastic parts. The primary purpose of designing multi-cavity molds is to enhance production efficiency and output while reducing manufacturing costs.
IC packaging substrates are widely used in downstream applications such as mobile terminals, communication devices, and servers/storage. With the continuous development of technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), the performance and packaging requirements for integrated circuits are becoming increasingly demanding. Consequently, the demand for IC packaging substrates is also continually rising.
