IC Packaging Substrate Mold for DIP and QFP

What is IC Packaging Substrate Mold for DIP and QFP?

IC packaging Lead Frame Mold are molds or models used for manufacturing IC packaging substrates. These molds are precisely processed and manufactured according to specific design requirements, ensuring that the produced IC packaging substrates have high precision, high density, miniaturization, and thinness. These characteristics are essential to meet the demands of integrated circuit packaging.

What does the DIP and QFP mean in the Semiconductor Area ?

The term "Dip-Qfp" as a mold for semiconductor packaging substrates is not a direct correspondence to a specific mold type, as DIP (Dual In-line Package) and QFP (Quad Flat Package) represent two distinct semiconductor packaging technologies. However, we can understand these two packaging technologies separately and explore their relationship with packaging substrate molds.

Classification:

Based on their packaging formats, the IC packaging molds can be divided into the following series:

Futures for IC Packaging Lead Frame Mold :

Compared to other plastic molds, IC packaging lead frame molds typically require higher precision and complexity. This is because they must ensure that the produced IC packaging substrates feature high precision, high density, miniaturization, and thinness to meet the stringent demands of integrated circuit packaging.

Application for IC Packaging Lead Frame Mold :

IC packaging substrates are widely used in downstream applications such as mobile terminals, communication devices, and servers/storage. With the continuous development of technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), the performance and packaging requirements for integrated circuits are becoming increasingly demanding. Consequently, the demand for IC packaging substrates is also continually rising.