IC Packaging Diode Series Box Molding Insert

What is IC Packaging Diode Series Box Molding Insert ?

The molding inlay strip of the IC packaged diode series mold box, as the name implies, refers to a precision inlay strip used for molding within the mold box (mold) during the IC (Integrated Circuit) packaging process, especially for the packaging of semiconductor devices such as diodes. This inlay strip is usually used in specific parts of the mold to ensure the precise positioning, fixing, and protection of semiconductor chips during the packaging process, while assisting in the molding of the package body and pin layout

Functions for the IC Packaging Diode Series Box Molding Insert :

● Positioning and Fixing: The molding inlay strip plays a crucial role in precisely positioning and fixing the semiconductor chip within the mold, ensuring that the chip remains in the correct location throughout the packaging process.

● Molding Assistance: With its specific shape and structural design, the molding inlay strip aids in achieving the desired shape, dimensions, and pin layout of the packaged body.

● Chip Protection: During the packaging process, the molding inlay strip also serves to protect the chip from mechanical damage or chemical corrosion, ensuring its integrity and functionality.

Application:

The IC Packaging Diode Series Box Molding Insert is widely utilized in the packaging processes of various diodes and other semiconductor devices. With the continuous advancement of semiconductor technology, the demands on packaging processes have become increasingly stringent. As a result, the design and manufacturing of molding inlay strips require constant innovation and optimization to meet the needs for higher precision, greater reliability, and lower costs.