What is IC Packaging Lead Frame Mold for SOP?
IC packaging Lead Frame Mold are molds or models used for manufacturing IC packaging substrates. These molds are precisely processed and manufactured according to specific design requirements, ensuring that the produced IC packaging substrates have high precision, high density, miniaturization, and thinness. These characteristics are essential to meet the demands of integrated circuit packaging.
Futures for IC Packaging Lead Frame Mold for SOP:
Compared to other plastic molds, IC packaging lead frame molds typically require higher precision and complexity. This is because they must ensure that the produced IC packaging substrates feature high precision, high density, miniaturization, and thinness to meet the stringent demands of integrated circuit packaging.
Application for IC Packaging Lead Frame Mold :
IC packaging substrates are widely used in downstream applications such as mobile terminals, communication devices, and servers/storage. With the continuous development of technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), the performance and packaging requirements for integrated circuits are becoming increasingly demanding. Consequently, the demand for IC packaging substrates is also continually rising.
Classification:
Based on their packaging formats, the IC packaging molds can be divided into the following series:
| DIP Series | SOP Series | QFP Series |
| BGA Series | PLCC Series |
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