IC Packaging Mold for Flip Chip and Chip on Board

What is IC Packaging Mold for Flip Chip and Chip on Board ?

The IC Flip Chip plastic mold, abbreviated as plastic mold for flip-chip packaging, is a specialized mold used for manufacturing plastic packaging components required in the flip-chip packaging process. Flip-chip packaging technology, also known as "flip-chip mounting" or "flip-chip packaging method," is a chip packaging technology that achieves electrical connection and mechanical fixation between the chip and the substrate by directly connecting the bumps on the chip to the substrate. The plastic mold serves as a crucial tool for shaping the plastic package during this packaging process.

What is the technical features for IC Packaging Mold for Flip Chip and Chip on Board

● Packaging Method: Flip-chip packaging technology differs from traditional wire bonding in that it directly connects the bumps on the chip to the substrate without the need for additional wires, thereby achieving higher packaging density and shorter signal transmission paths.

● Mold Design: The design of the plastic overmolded mold for flip-chip packaging requires consideration of chip size, bump layout, substrate structure, and the properties of the packaging material to ensure the precision, reliability, and production efficiency of the package.

● Material Selection: The mold material is typically chosen for its high strength, wear resistance, and corrosion resistance, such as carbide, stainless steel, and other materials that can withstand high pressure, high temperature, and multiple injection molding cycles.

● Manufacturing Process: The mold manufacturing process encompasses multiple stages, including design, processing, assembly, and debugging. It necessitates the use of precise mechanical processing and injection molding techniques to ensure the mold's accuracy and durability.

Why choose XP mold as a IC packaging Mold supplier ?

1. Comprehensive Services: We offer a full range of services, from mold design ,mold making and injection molding.

2. Expert Technical Team: Our team, with over 10 years of experience in mold industry, adeptly handles any technical issues.

3. Precision Machinery: We use advanced machinery and testing equipment imported from Germany and Japan, ensuring the highest quality.